Principal Packaging Engineer
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IC Resources
Rogerstone
My client is looking for a Principal Semiconductor Packaging Engineer to lead the development of next-generation 2.5D and 3D packaging technologies. What you’ll do: - Architect innovative 2.5D/3D packaging solutions from concept to prototype. - Lead advanced packaging R&D programmes and technology roadmaps. - Oversee design, assembly, test, and validation of complex semiconductor packages. -... |
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a day ago
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